1、技术简介
  本项目提供了一个非接触式、偏离度的新测试方法，是半导体生产制造检测的新方法和新技术，为提高半导体器件生产合格率提供了可靠技术保障。
  该技术使用环形振荡器(RO)的测试电路结构，内置光电二极管，放置在芯片活动模区，使“变异性测试”跨晶片和模内变异性。 非接触式测试系统向测试结构发送激光信号。然后测试结构中的光电二极管接收信号并激活测试电路，然后将信号发回系统收集和分析输出数据。
该技术功能输出数据度量与关键制造过程步骤直接相关，以优化先进半导体制造过程中的功率、性能和泄漏。 在线路物理计量方面，它的跨模和跨晶覆盖范围有限，缺乏必要的与最终性能参数和结果的强而直接的关联。此外，对测试晶圆片或抄写器的功能性接触探测在本质上是断断续续的，在范围上也很有限。
  摘要采用基于环形振荡器(RO)的功能器件性能指标与先进半导体器件制造中的关键工艺步骤直接相关，并证明了该技术可以优化功率、性能和弥补泄漏。
2、主要特点
 非接触式、偏离度的新测试方法，在测试结构上避免了有限的空间消耗，使功能测试电路在活动模组和晶圆片上的高密度部署成为可能：
（1）占地面积小
（2）测试结果可以代表实际功能电路的电学性能 
（3）不需要架空线路、共用电线或电垫来启动和输出信号检测
（4）测试电路可以在第一层金属连接(M1)或更早的时候被功能激活和测量。
3、主要目标
 该技术主要目标是为半导体器件制造提高成品率。半导体器件的制造是一个多步骤、复杂的过程。可以执行许多步骤。每一个工序都需要使用超灵敏的机械和技术。因此，对制造过程的质量进行持续的监控通常是需要的。如果在制造过程中遇到问题，如缺陷和/或工艺偏差，并迅速发现，制造商可以采取补救措施。
4、应用领域
 该技术可用于半导体制造过程，包括潜在的产品提供:
（1）电气特性测试结构(包括设计服务)
（2）分析软件
（3）测量设备硬件
（4）大数据分析软件
（5）设计知识产权许可
5、市场前景
 非接触式、偏离度的新测试方法可以取代PDF解决方案(Nasdaq: PDSF)业务的一部分。pdf解决方案提供的软件解决方案，旨在使客户能够降低IC设计和制造成本，提高上市时间，并提高盈利能力。目前，PDF解决方案的市场资本规模约为3.10亿美元。
6、效益分析
 目前，由于新的半导体产品与元器件的尺寸不断微缩，工艺复杂，设计周期长，导致新的半导体技术节点导入变缓。同时，晶圆、芯片内的Variability(例如跨晶片变异性)也是导致产品合格率下降的一个重要原因。此项新的测试技术可以对晶圆、芯片产品整个生产过程进行持续监控和检测，同时，可提供从早期研发/特性到高产量的设计、过程和产品的早期直接观察（判断）。此项测试技术已经在产品芯片上得到验证，预计可以减少20-40%产品验证的周期时间。 

备注：
（1）本技术转让价格为美元结算价格，该价格包含美国、中国、日本、韩国等注册登记的21项专利技术全部所有权。
（2）为配合和清楚表达该技术应用领域，本项目所使用的产品示范性彩色模拟图片由中技网提供。

（3）美国TEL Venture Capital Inc 21项专利技术见英文版登记注册详细目录。

A new test method for non - contact deviation degree

1.      The brief description of the technology. 

New concept and technique of semiconductor manufacturing test to improve the manufacturing yield.

·         The test circuit structures using ring oscillators (RO) with built in photo diode placed in chip active die area enables “variability test”  across wafer and within-die variability.

·         The non-contact test system sends the laser signal to the test structures.  Then the photo diode in the test structure receives signal and activate the test circuits, and then send the signal back to the system to collect and analyze the output data.

·         The functional output data metric offers direct correlation with critical manufacturing process steps to optimize power, performance and leakage in advanced semiconductor manufacturing process

In line physical metrology is limited in its cross-die and cross-wafer coverage and lacks the necessary strong and direct correlation to final performance parameters and results. Also functional contact probing on test wafers or in the scribe is intrinsically episodic and limited in scope and coverage.  A functional device performance metric based on ring oscillators (RO) has been employed to offer a direct correlation with critical process steps in advanced semiconductor device manufacturing and the technique has been demonstrated to optimize power, performance, and leakage.

2.      The main characters of the technology;

·         This new test structure avoids consuming limited space and enables high density deployment of functional test circuits across the active die and wafer

o       Small foot footprint

o       Product representative test circuit in the active product

o       No need for overhead circuitry, shared wiring or electrical pads for activation and output signal detection.

·         The test circuits can be functionally activated and measured as early as the first-layer metal connectivity (M1) and beyond.

3.      The main targets of the technology;

Semiconductor device manufacturing to improve yield:

Semiconductor device fabrication is a multi-step and complex process. Numerous steps may be performed. Each process step requires the use of ultra-sensitive machinery and techniques. Accordingly, it is often desirable to continuously monitor the quality of the fabrication process. If problems, such as defects and/or process excursions are encountered in the fabrication and detected quickly, the fabricator can take remedial action.

4.      Field of application;

This technology can be used for semiconductor manufacturing process including the potential product offerings of:

·         Electrical characterization test structures (including design service)

·         Analysis software

·         Measurement hardware,

·         Big-data analytic software

·         Design IP licensing

5.      Market prospect;

·         This new technology can replace the part of the business of PDF Solutions (Nasdaq: PDSF), the leading provider of yield improvement technologies and services for the IC manufacturing process.

·         PDF Solutions offers software solutions that are designed to enable clients to lower costs of IC design and manufacture, enhance time to market, and improve profitability.

·         Market Capitalization of PDF Solution today- approximately USD$310,000,000

6.      Benefit analysis,

·         Recent new semiconductor product introduction is taking longer, driven by

o       Advances in process technologies, new devices and “shrinks”

o       Increasing design and process complexity

o       Power-Performance balance

o       Increasing yield detractors (e.g. across-chip variability)

·         This new test concept enables across-die performance measurement, and provides early direct insight into the design, process and product from early R&D/Characterization to High-Volume Production

·         This new test concept has been verified on product die delivering an estimated 20-40% cycle time reduction.

Remark:

    (1) The price of this technology transfer is US dollar settlement price,which includes the full ownership of 21 registered patented technologies including the United States, China, Japan and Korea.

    (2) in order to cooperate with and clearly express the application field of this technology, the product demonstration color simulation pictures used in this project are provided by cntnet.

    (3) 21 patent technologies of TEL Venture Capital Inc are listed in the English version registration details directory.

TEL Venture Capital Inc 21 patent technology registration details directory

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